PART |
Description |
Maker |
TH50VSF4682AASB TH50VSF4683AASB |
MULTI-CHIP INTEGRATED CIRCUIT SILICON GATE CMOS SRAM AND FLASH MEMORY MIXED MULTI-CHIP PACKAGE
|
TOSHIBA
|
AM42DL640AG85IS AM42DL640AG AM42DL640AG25IT AM42DL |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 64 Megabit (8 M x 8-Bit/4 M x 16-Bit) CMOS 3.0 Volt-only 64 Megabit (8 M x 8-Bit/4 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory and 16 Mbit (1 M x 16-Bit) Static RAM
|
SPANSION Advanced Micro Devices
|
A82DL3234 A82DL3244 A82DL3224UG-70 A82DL3224TG-70 |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL32x4T(U) 32 Megabit (4Mx8 Bit/2Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash 堆叠式多芯片封装(MCP)闪存和SRAMA82DL32x4T(ü)32兆位Mx8 Bit/2Mx16位)的CMOS 3.3伏只,同时闪电行 Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL32x4T(U) 32 Megabit (4Mx8 Bit/2Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash 堆叠式多芯片封装(MCP)闪存和SRAM,A82DL32x4T(ü)32兆位Mx8 Bit/2Mx16位)的CMOS 3.3伏只,同时闪电行 Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL32x4T(U) 32 Megabit (4Mx8 Bit/2Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash 堆叠式多芯片封装(MCP)闪存和SRAM,A82DL32x4T(ü)32兆位4Mx8 Bit/2Mx16位)的CMOS 3.3伏只,同时闪电行
|
AMIC Technology, Corp. AMIC Technology Corporation
|
AM49DL320BGT851 AM49DL320BGT85IS AM49DL320BGT85IT |
32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory and 32 Mbit (2M x 16-Bit) Pseudo Static RAM Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous
|
AMD[Advanced Micro Devices] SPANSION[SPANSION]
|
AM42DL6404G AM42DL6404G85IS AM42DL6404G85IT AM42DL |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 64 Megabit (8 M x 8-Bit/4 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory and 4 Mbit (256 K x 16-Bit) Static RAM
|
SPANSION[SPANSION] AMD[Advanced Micro Devices]
|
AM49DL640BG85IS AM49DL640BG AM49DL640BG25IS AM49DL |
64 Megabit (8 M x 8-Bit/4 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory and 32 Mbit (512 K x 16-Bit) Pseudo Static RAM Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
AMD[Advanced Micro Devices] SPANSION
|
M39P0R9070E2 M39P0R9070E2ZADE M39P0R9070E2ZADF |
256 or 512Mbit (x16, Multiple Bank, Multi-Level, Burst) Flash memory 128 Mbit Low Power SDRAM, 1.8V supply, Multi-Chip Package
|
Numonyx B.V
|
S75NS128NDEZFWNK0 S75NS128NDEZFWNK3 S75NS128ND0ZFW |
1.8 Volt-only, Stacked Multi-Chip Product (MCP) x16 MirrorBit Flash Memory and DRAM
|
SPANSION[SPANSION]
|
M36LLR8760B1 M36LLR8760M1 M36LLR8760TT M36LLR8760D |
256 128 Mbit (Multiple Bank, Multi-Level, Burst) Flash Memory 64 Mbit (Burst) PSRAM, 1.8V Supply, Multi-Chip Package
|
意法半导 STMicroelectronics ST Microelectronics
|
CMCM |
Ceramic Multi-Chip Module Package
|
Amkor Technology, Inc.
|
WEDPS512K32-12BC WEDPS512K32-12BI WEDPS512K32-12BM |
512Kx32 SRAM MULTI-CHIP PACKAGE
|
WEDC[White Electronic Designs Corporation]
|